
MAX1112/MAX1113
+5V, Low-Power, Multi-Channel,
Serial 8-Bit ADCs
______________________________________________________________________________________
19
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
VDD
SCLK
CS
DIN
CH3
CH2
CH1
CH0
TOP VIEW
SSTRB
DOUT
DGND
AGND
CH7
CH6
CH5
CH4
12
11
9
10
REFOUT
REFIN
SHDN
COM
MAX1112
SSOP
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
VDD
SCLK
CS
DIN
SSTRB
DOUT
DGND
AGND
CH0
CH1
CH2
CH3
COM
SHDN
REFIN
REFOUT
MAX1113
QSOP
Pin Configurations
___________________Chip Information
Ordering Information
PART
MAX1112C/D
MAX1112EAP+
-40°C to +85°C
0°C to +70°C
TEMP RANGE
PIN-PACKAGE
Dice*
20 SSOP
PROCESS:CMOS
SUBSTRATE CONNECTED TO DGND
MAX1112CAP+
0°C to +70°C
20 SSOP
MAX1113CEE+
0°C to +70°C
16 QSOP
MAX1113EEE+
40°C to +85°C
16 QSOP
+Denotes a lead(Pb)-free/RoHS-compliant package.
*Dice are specified at TA = +25°C, DC parameters only.
Package Information
For the latest package outline information and land patterns
(footprints), go to
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
20 SSOP
A20+1
16 QSOP
E16+1